Foundries
Latest TL;DRs on Foundries from QLANKR News.
- TSMC Expects AI Boom to Continue Through 2026 — TSMC's chairman predicts robust demand for AI chips will not ease until at least 2026, driven by artificial intelligence development. - This contradicts some…
- US Confronts National Security Risk in Chinese AI Chip Boards — The US government expresses national security concerns over Chinese-made circuit boards embedded within AI chips used in critical infrastructure. - Printed…
- Texas County Approves Reinvestment Zone for SpaceX Terafab Chip Facility — A Texas county has approved a reinvestment zone for a significant SpaceX chip manufacturing facility expected by 2026. - The facility, named Terafab, aims to…
- Intel Addresses 18A Process Node Delays — Intel executives acknowledged significant challenges and delays with their 18A manufacturing process, clarifying it was a one-off issue. - Intel’s CFO David…
- Samsung demonstrates HBM5 memory with new Heat Path Block cooling — Samsung revealed its HBM5 memory with Heat Path Block cooling at Computex 2026, targeting a key thermal bottleneck in AI memory packaging. - Samsung's…
- EU Seeks Tech Independence with 'Made in Europe' Initiative — The European Union pushes for reduced reliance on foreign big tech by boosting domestic semiconductor and other critical tech production. - The initiative aims…
- AI Infrastructure Expands to Floating Data Centers, Material Tech — The AI supply chain has expanded significantly beyond traditional components like GPUs and HBM, now integrating a broader range of new industries and resources…
- SK Hynix, Samsung Propel South Korea's AI Chip Boom — South Korea's Kospi stock market hit record highs, driven by soaring valuations of chipmakers SK Hynix and Samsung, fueled by AI chip demand. - SK Hynix and…
- Japan Retrieves Rare-Earth Sample from Deep-Sea Seabed — Japan's rare-earth project successfully retrieved a sample from 6,000 meters deep on the seabed for analysis. - The mission involved specialized equipment to…
- Intel Struggles to Supply New Core Ultra Series 3 Chips — Intel faces supply bottlenecks for its new Core and Core Ultra Series 3 processors, impacting laptop manufacturers. - The new chips are made using Intel's 18A…
- Intel Discusses Xeon 6+, 18A Wafer Allocation, and AI Demand — Intel's Kira Boyko and Tim Wilson detailed Clearwater Forest Xeon 6+ processors at Computex, addressing technical choices and production challenges. - Intel…
- Intel CEO Pat Gelsinger Praises Nvidia and TSMC Amid Competition — Intel CEO Pat Gelsinger acknowledged Nvidia and TSMC as important partners despite intensifying competition in the semiconductor market. - Gelsinger…
- AMD Re-Engineers Ryzen 7 5800X3D for Anniversary Release — AMD brought back the Ryzen 7 5800X3D with significant re-engineering due to changes in TSMC's bonding process. - The original TSMC SoIC hybrid bonding…
- SK Hynix to Double Wafer Capacity for AI Demand — SK Hynix plans to double its wafer capacity within five years to address the increasing demand for memory chips driven by AI applications. - Production…
- Kioxia Battles Samsung with Wafer-Bonding Tech for Advanced Memory — Kioxia plans to deploy wafer-bonding technology for NAND memory chips, aiming to compete with Samsung's market leadership. - The technique integrates logic…
- US Chip Firms Lead Global Subsidy Totals — US-based semiconductor firms received more government support than any other region, although China's subsidies were larger relative to its chip industry…
- EU Commission Reworks Flagship Chips Act Program for 2026 — The European Commission will reset its 2026 Chips Act agenda to better reflect changing market realities and address funding challenges. - The initial Chips…
- Huawei Seeks Next-Gen AI Compute Beyond Moore's Law — Huawei aggressively invests in chip innovation and new computational paradigms, aiming to overcome current semiconductor manufacturing limits and maintain…
- Intel Explores Advanced Chip Packaging Facility in India — Intel is considering establishing an advanced semiconductor packaging and assembly unit in Odisha, India, partnering with 3DGS. - This move aligns with India's…
- Intel Xeon 6+ 'Clearwater Forest' debuts in data centers — Intel launches its Xeon 6+ processor, codenamed 'Clearwater Forest', bringing 18A process technology to data centers with high core counts and improved…
All topics · Home