MediaTek Partners With Intel, TSMC for Advanced Chip Packaging
TL;DR. MediaTek collaborates with Intel and TSMC on advanced chip packaging technologies, securing Intel as a new foundry customer. - MediaTek will use Intel's advanced packaging for chips expected to launch in 2025. - The partnership marks a significant win for Intel Foundry Services in customer acquisition. - TSMC's role in the collaboration was not specified beyond advanced packaging discussions.
- MediaTek will utilize Intel Foundry Services for advanced chip packaging, specifically for chips slated for 2025.
- This deal represents a major customer win for Intel's foundry business, leveraging its packaging technology.
- TSMC is also involved in advanced packaging discussions with MediaTek, indicating a multi-vendor strategy.
Sources
- Taiwan's MediaTek partners with Intel and TSMC for advanced chip packaging — asia.nikkei.com
- reuters.com — reuters.com