Samsung demonstrates HBM5 memory with new Heat Path Block cooling
TL;DR. Samsung revealed its HBM5 memory with Heat Path Block cooling at Computex 2026, targeting a key thermal bottleneck in AI memory packaging. - Samsung's technology aims to resolve heat challenges in the die-to-die interface of high-bandwidth memory stacks. - This development follows rival SK hynix's recent unveiling of its integrated HBM thermal design. - Samsung manufactures the HBM5 base die using its in-house 2nm process, moving past the 4nm node.
- Samsung displayed a physical mockup of its HBM5 memory with Heat Path Block (HPB) cooling at Computex 2026.
- HPB is designed to specifically address the D2D PHY layer's escalating heat and power density.
- Samsung is fabricating the HBM5 base die on its 2nm process, reducing from 4nm in previous generations.
- This move comes after competitor SK hynix introduced its own iHBM thermal solution targeting similar issues.