Noctua details thermosiphon prototype development and launch
TL;DR. Noctua showcased an advanced thermosiphon liquid cooling prototype at Computex 2026 with a Q3 2027 target launch. - The passive cooling system uses a phase-change fluid to move heat away from the CPU without a pump. - Innovations include a sintered copper layer on the evaporator to improve wicking and prevent bubble formation. - Testing against an AIO cooler showed comparable CPU temperatures on a 230W Ryzen 9 9950X3D system.
- Noctua presented an improved thermosiphon liquid cooler prototype at Computex 2026.
- The passive cooling design aims for a Q3 2027 release.
- New evaporator technology with sintered copper enhances efficiency by preventing insulation.
- The prototype matches AIO performance on a high-power AMD CPU.