Intel Explores Advanced Chip Packaging Facility in India
TL;DR. Intel is considering establishing an advanced semiconductor packaging and assembly unit in Odisha, India, partnering with 3DGS. - This move aligns with India's efforts to attract major chip manufacturing investments to become a global semiconductor hub. - The facility would boost domestic chip production and reduce reliance on foreign supply chains. - Advanced packaging is crucial for high-performance AI chips and data center infrastructure.
- Intel exploring semiconductor facility in Odisha, India.
- Potential partnership with 3DGS for advanced packaging.
- Supports India's ambition to become a semiconductor manufacturing hub.
Sources
- Intel, 3DGS Explore Advanced Semiconductor Packaging Facility in Odisha — analyticsindiamag.com