Foxconn to Ship AI Data Center Transmission Tech
TL;DR. Foxconn plans to ship 10,000 Co-Packaged Optics (CPO) trays this year, targeting advanced AI data centers with next-generation transmission technology. - CPO integrates optical and electrical components directly onto a single substrate, reducing power consumption and latency. - The technology is critical for handling the massive data loads and high-speed communication required by AI models. - Foxconn's chairman highlighted the CPO tray shipments as a significant step for AI infrastructure.
- Foxconn will ship 10,000 CPO trays in 2024.
- CPO technology combines optical and electrical components for improved data transmission.
- The new tech aims to enhance efficiency and performance in AI data centers.
Sources
- Foxconn to start shipping next-gen transmission tech for AI data centers — asia.nikkei.com
- aidatacentermap.org — aidatacentermap.org